Assembly Technology

• Wafer Sawing for Si and SiC die
• Pb and Pb-free solfsolder D/A
• Pressure-less Ag Sintering
• Multi- and Stack-die options
• Heavy Aluminum and Cu-core-Al Wirebonding
• RoHS and High CTI Mold compound
• Sn-plating
• Static Test - Room Temperature

Certification

• ISO 14001, IATF 16949